aluminum nitride中文,aluminum nitride的意思,aluminum nitride翻译及用法

2026-05-05 13:42 浏览次数 19

aluminum nitride

英[əˈlu:mənəm ˈnaitraid]美[əˈlumənəm ˈnaɪˌtraɪd]

[无化] 氮化铝

aluminum nitride 片语

片语

silica-aluminum nitride氧化硅

titanium aluminum chromium nitride氮化钛铝铬

aluminum nitride clusters氮铝团簇

aluminum nitride crystal氮化铝单晶

Aluminum m nitride氮化铝

aluminum nitride whisker氮化铝晶须

aluminum nitride packagingaln基板

ALUMINUM NITRIDE PASTE糊状氮化铝

aluminum nitride 例句

英汉例句

  • Instead of a beam, they fashioned a tiny diving board of aluminum nitride plated with aluminum that vibrated by getting thinner and thicker.

    研究者们利用一块镀铝的氮化铝微小跳板代替了光束,跳板上的铝层通过变薄和变厚来进行振动。

  • The method solves the problem of poor bonding between Cu and aluminum nitride ceramic, and can realize preparation of gradient composite with high temperature difference and poor compatibility.

    本发明结合了放电等离子烧结和分步 烧结的方法,解决了金属铜和氮化铝陶瓷之间的结合困难问题,也实现了高温差、高不相容性梯度复合材料的制备。

  • We obtained rods, flakes, spheres, porous aluminum nitride by control of synthesis conditions, respectively.

    实验中通过控制条件得到了棒状、片状、球状和多孔形貌的氮化铝粉末。

  • Since coefficients of thermal expansion between aluminum nitride and silicon are near, large thermal stress will not be introduced.

    氮化铝的热膨胀系数与硅的十分接近,因此不会引入大的热应力。

  • The method comprises: (1) sintering aluminum nitride ceramic at a low temperature by plasma-discharging sintering;

    该方法主要包括三个部分:(1)利用放电等离子烧结技术实现氮化铝陶瓷的较低温度烧结;

  • The method avoids the problem that the wafer break is caused by thermal stress in the course of cooling down, especially is suitable for preparing gallium nitride and aluminum nitride substrates.

    该方法避免了降温过程中热应力造成的晶片破裂问题,尤其适于氮化镓、氮化铝衬底的制备。

  • However, there has not article about direct synthesis of aluminum nitride in high-energy ball mill.

    但用高能球磨直接氮化合成氮化铝的方法尚未报道。

  • The results show the good crystallinity of the powder was obtained when using xylene as solvent, and the purity of aluminum nitride obtained increase with the reaction temp...

    结果发现,用二甲苯为溶剂合成的氮化铝结晶度好,而生成的氮化铝纯度随着反应温度升高而增加,同时表面活性剂的加入对结晶度也存在一定的影响。

  • The process of flip chip based on aluminum nitride is studied.

    研究了以氮化铝为基板的倒扣封装的工艺。

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