英汉例句

• under the assumption of only tow kinds of mobile alkali ions in glass, a model for the metal glass electric field assisted anodic bonding is proposed.

  在假设玻璃中仅有两种可动堿金属离子的情况下，提出了一个金属玻璃电场辅助阳极连接模型。

• anodic bonding is a new way to realize the bonding between solid electrolyte glasses(ceramics) and metals through the interaction process of electricity and heat.

  阳极键合是一种利用电和热相互作用实现固体电解质玻璃（陶瓷）与金属材料固态连接的一种新方法。

• the results show that the current decays rapidly at early stage during anodic bonding and then decreases slowly;

  本文结果表明，连接初期电流迅速衰减，随后缓慢变小，直至某一稳定值；

• this paper introduces the background and technical characteristic of anode bonding, gives the gist of anode material and cathode material selection, then the vista of anodic bonding application.

  介绍了阳极连接产生的背景、工艺特点，给出了阳极连接中阳极材料和阴极材料的选择依据，展望了阳极焊的工业应用前景。

• the results shows that anodic bonding is suitable for the package of high temperature pressure sensors.

  研究结果表明高温压力传感器可以采用静电键合技术进行封装。

• according to the mechanism of anodic bonding, we made a kind of low melting point glass for bonding material, and have preliminarily finished room temperature anodic bonding experiment.

  根据静电封接的机理，配制了一种低温玻璃作为封接材料，初步完成了常温下的静电封接实验。

• the physical model for anodic bonding is constructed base on valence bond theory, and the essence relationship between bond result and circuit character is obtained.

  基于价键理论，建立了阳极键合的机理模型，进一步得到键合过程的外电路电学特性与键合质量的内在关系。

• technologies of making through holes in glass wafer and anodic bonding have been studied, the improvements for anodic bonding have been present, and through holes array has also been achieved.

  研究了玻璃通孔制作工艺并完成了所需通孔阵列制作；分析了阳极键合技术中可能存在的问题并给出了改进措施；

• anodic bonding applied in the joining of solid electrolyte borosilicate glass and silicon is achieved with bonding machine in the assistance of static electric field.

  固体电解质（玻璃）与硅片通过阳极连接可以实现良好键合。

• this paper investigates one kind of micro heat pipe arrays(mhpa), which are fabricated by advanced silicon bulk micromachining and anodic bonding technology.

  介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。

• to reduce the production costs and simultaneously obtain high production quality, a flexible microassembly system for automated anodic bonding of mems sensors is developed.

  为了降低生产成本，同时提高传感器的产品质量，研制了柔性自动阳极键合系统。

• effects of point cathode anodic bonding are theoretically investigated by using electrical circuit analog. the bonding current, incubation period and intimate contact area are calculated.

  用等效电路的方法研究了点阴极情况下的电场辅助阳极连接效应，计算了连接电流、连接孕育期和紧密接触面积。

• finally experiments of anodic bonding and au-si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.

  最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。

• anodic bonding technology of semiconductor silicon and glass wafer is key technology of mems. as one of the key materials, there is a broad industrial applied future about anodic bonding glass.

  半导体硅与玻璃的静电键合技术是微电子机械系统（mems）的关键技术，而作为关键材料之一的静电键合玻璃有着广阔的工业应用前景。

• the stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.

  通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。