片语

copper clad铜箔；包铜的

Quality Control of Plated Copper-Foil电解铜箔的质量管理

resin coated copper foil涂胶脂铜箔；涂树脂铜箔；背胶铜箔

paper r copper laminated foil纸质复铜薄板

copper and foil铜箔

electro copper foil电镀铜箔

paper copper lfeelindinedd foil纸质复铜薄板

annealed copper foil退火铜箔

Copper-foil conducting electricity导电铜箔

paper copper laminated foil纸质复铜薄板

英汉例句

• Various insulating materials as electronic shield materials, PVC, film, Mylar , copper foil . aluminum foil, foam, ect.

  电子屏蔽材料、PVC 、胶片、麦拉纸、铜箔、铝箔、泡棉等多种绝缘材料。

• The most suitable for short shaft. It can show the outstanding performance while coiling metal foil, copper foil and aluminum foil.

  最适合短轴使用，卷取金属箔，铜箔，铝箔时，更显现出其卓越性能。

• Both copper foil and brass plate have the phenomenon of dezincification, the copper foil had more serious corrosion than brass plate than in the acid environment.

  铜箔和黄铜板都有脱锌腐蚀的现象发生，铜箔在酸性气体中的腐蚀程度比黄铜板要严重的多。

• A number of scientists, yet, are focussing on the improvement of graphene growth over transition metal substrate such as copper foil substrate.

  但一些科学家仍致力于改进借助过渡金属基质的石墨烯生产方法，比如说借助铜箔基板。

• The results indicate that the reducing reaction of electrolyte on the foil with rough surface is much visible than on that with shiny surface, the dissolution potential of matte copper foil is 0.

  结果表明，电解液在毛面铜箔表面发生还原反应的程度比在光面铜箔表面显着，其阳极溶解电位比光面铜箔约低0。

• After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.

  经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。

• The influence of copper foil surface quality on electrical performance of power transformer is analyzed, the key technology for monitoring the surface flaw with machine vision system is studied.

  分析铜箔表面质量缺陷对电力变压器电气性能的影响，研究采用机器视觉系统对铜箔表面质量缺陷监视的关键技术。

• At the same time copper foil has excellent shield performance.

  同时铜金属箔具有优异的屏蔽性能。

• The situation of the copper foil applied to transformers is introduced. The economy, characteristics and types of the transformer with foil windings are presented.

  介绍了铜箔在变压器应用的现状，概述了箔式绕组变压器的种类、特点及经济性。

• The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.

  金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。

• From the view of the raw materials used for manufacturing DCB plate, the influence of copper foil and ceramic material on the properties of DCB is studied.

  从原材料的角度，研究了制作DC B板所使用的铜箔和陶瓷材料对其性能的影响。

• The product has level surface, stable performance, and high bonding strength to copper foil and aluminum foil;

  该产品表面平整、性能稳定、对铜箔、铝箔粘接强度高；

• The ideal formula of the adhesive is determined by series of experiments and the reaction process and thermal stability of copper foil adhesives are studied by te, TGA and DTA.

  通过一系列研究确定了胶粘剂的理想配方，并通过红外光谱、热失重和差热分析法对其铜箔胶粘剂的反应过程和热稳定性进行了探讨。

• The technical measures to improve roughness copper foil and strengthen dispersion of carbon black were introduced.

  介绍了提高铜箔粗化度及加强碳黑分散的工艺措施。

• Working principle for the cathode roller in electrolytic copper foil production was established. Increasing current density on the cathode roller can increase productivity of the copper foil.

  增大电流密度可以提高铜箔的生产率，保证稳定的电流密度，可以生产出一定厚度的铜箔，并给出了实用的设计準则。

• The test on copper foil in winding shows the monitoring method is effective, and the device can find flaws such as burr, Nick, and pinhole.

  对箔绕机上的铜箔试验表明该方法有效可行，能监测铜箔表面的毛刺、划痕及小孔等质量缺陷。

• Also called adhesive copper foil and copper foil tape is the copper metal surface covered a layer of acrylic rubber, can be divided into: double guide copper foil tape and single copper foil tape.

  铜箔胶带也叫自粘铜箔，是在铜金属表面覆一层亚克力胶，可分为：双导铜箔胶带和单导铜箔胶带。

• The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years.

  印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。

• Set up in 1955, Yates foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry.

  美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。

• Equivalent heat conductivity of PWB is related to the thickness of PWB, the residual ratio of copper foil and the thickness of copper foil.

  PWB的等效导热系数与PWB的总厚度、铜箔剩余率及铜箔厚度有关，设计时需考虑相关因素。

• The control of tension upon rolling-up in copper foil production;

  论文具体针对凹板印刷机的收放卷张力控制展开讨论。

• The relationship of the welding seam microstructure of the drum cathode and the light region forming on the copper foil surface was studied.

  研究了阴极辊焊缝处组织与电解铜箔表面上形成的光亮带之间的关系。