2025-10-08 13:50 浏览次数 10
双嵌入式
in this paper, we propose the investigation of the void in dual damascene process and the hole and trench with large aspect ratios between width and height.
本论文主要针对双层镶嵌制程所造成的孔隙及具有高深宽比的极窄和极深的通孔和沟槽所造成的影响加以探讨及研究。