片语

electronic chip packaging电子芯片封装

electronic system packaging电子系统封装

electronic combined packaging电子信息组合包装

electronic organ packaging电子封装

electronic product packaging电子产品包装

Electronic c Packaging Materials电子包装材料

Electronic Component Packaging Module电子元件封装模

electronic circuit packaging电子电路组装

Electronic products packaging电子产品包装

英汉例句

• the state-of-the-art of modern electronic packaging technologies and its future trends are de- scribed in the paper.

  高度发达的信息社会急需先进的电子封装技术，本文概述了电子封装技术的现状和发展趋势。

• abstract :the effects of nano-fillers on electrically conductive adhesives (ecas) applied to electronic packaging were theoretically analyzed.

  本文从理论上分析了纳米填料在电子封装用导电胶中的作用。

• obviously, the two different attitudes towards oppor aoitunities may lead to electronic packaging quite different consequences.

  可见，两种不同的对待机遇的态度导致了截然不同的后果。

• the principle barrier to higher compute density in modular electronic packaging is the cooling of high dissipation devices, most notably, the new breed of multi-core microprocessors.

  高计算密度电子封装模块的主要障碍就是散热设备的冷却功能。

• electronic packaging design;

  电子封装设计；

• with the feature of the electronic packaging in different steps, the development of the electronic packaging cad were discussed and the trend was chiefly analyzed in this paper.

  本文结合各个时期电子封装的特点，介绍了封装cad技术的发展历程，并简要分析了今后发展趋势。

• in this paper, new progress of electronic packaging technology is presented.

  本文综述了电子封装技术的最新进展。

• city university of hong kong; centre for electronic packaging and assemblies, failure a analysis and reliability engineering.

  陈忍昌教授，香港城市大学，电子封装及组装暨失效分析及可靠性工程中心。

• the present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.

  本文综述了电子封装技术的现状以及我国如何面对无铅化的问题。

• because of the compact design of flip chips and csps in electronic packaging , acoustic microimaging has become extremely important for inspecting these packages .

  随着电子封装技术不断朝着微型化的发展，在检查倒装芯片封装和芯片规模封装中，声学微成像技术得到了极大的应用。

• the rapid development of electronic packaging technology has led to strict requirement for packaging materials.

  电子封装技术的快速发展对封装材料的性能提出了更为严格的要求。

• in recent years, with the development of information industry, the needs of high quality fine wire bonding for electronic packaging increase quickly.

  随着信息产业的迅速发展，对电子封装用集成电路键合线的需求量日益增加，而且对质量提出了越来越高的要求。

• a new experimental technique on the cte measurement of metal composite leads in electronic packaging using laser speckle interferometry was presented.

  散斑干涉或电子散斑干涉计量应用于连续运动或变形物体时 ，就会产生一个时变的散斑干涉场。

• the prospects for the further development of electronic packaging materials were given.

  并展望了电子封装材料的发展前景。

• ansys q3d extractor software is the premier 3-d and 2-d parasitic extraction tool for engineers designing electronic packaging and power electronic equipment.

  ansysq3d提取软件是首屈一指的3-d和2-d寄生提取工具，电子封装和电力电子设备设计的工程师。

• market prospects: as china's electronic packaging industry, to promote the rapid development of direct the metal ─ glass package technology development.

  市场前景：随着我国电子封装业的飞速发展，直接促进着金属─玻璃封装技术的发展。

• the resin had better process properties, higher mechanical properties, and could be used as a rtm matrix resin for high performance composites or as a high performance electronic packaging resin.

  实验结果表明，这种树脂具有良好的工艺性能和较高的力学性能，可作为树脂传递模塑成型rtm的高性能复合材料基体树脂或高性能封装用树脂。