tension and fatigue tests on a widely used packaging epoxy molding compound (emc) were performed under room and high temperatures.
对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
waste epoxy molding compound powder;
废环氧模塑料粉;
the recent research and development of the high performance epoxy molding compounds are summarized in the present paper.
本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。
the performance of epoxy molding compound, its relationship between the property and component, modification methods and its development trends were narrated in detail.