the metallization process was studied. the interface phenomena and combined mechanism of metallization film were studied with the help of xps, xrd and sem analyses.
探讨了金属化的工艺条件,运用xps,xrd,sem等现代分析技术研究了界面现象及粘附机理。
and the displacement process is a process of fluid mass and heat transfer, which refers to many interface phenomena changed with time and space.