this indicates that the metal thin film and multilayer materials will be applied more widely to microelectronic components.
这预示着更多的金属薄膜及多层膜材料应用于微电子元器件中。
electromigration in metal thin film interconnection is one of the important problems for vlsi reliability.
金属薄膜互连的电迁移现象是vlsi最重要的可靠性问题之一。
also, the reflective film may have an anchor coat layer between the base layer and the metal thin film layer.
另外,在上述基体材料层和金属薄膜层之间,还可以具有增粘涂层。
to describe the non-equilibrium phenomenon in metal thin film radiated by femtosecond laser, numerical simulation for temperature field of metal film was performed by finite-difference method.
为描述飞秒激光与金属薄膜相互作用过程中的非平衡传热现象,利用有限差分法对金属薄膜内的温度场进行了一维数值模拟。
then, oxidation treatment such as heat treatment is performed to oxidize the metal thin film partly or entirely.
然后,执行诸如热处理之类的氧化处理以部分或全部地氧化该金属薄膜。