英汉例句

• a passivation layer assembly and a display substrate having the same are presented.

  本发明提供了一种钝化层组件以及具有该钝化层组件的显示基板。

• the compact passivation layer can prevent al nanopowder further oxidizing. as a result, passivated al nanopowder not only has high activity, but can be stored steadily in the standard atmosphere.

  钝化层阻止了铝粒子的进一步氧化，从而达到了使纳米铝粉即保持高活性同时又能稳定存在大气中的目的。

• the passivation layer (18) is patterned to form a first opening (20) to contact the last interconnect layer (16).

  该钝化层（18）被图案化以形成第一开口（20）以接触最后的互连层（16）。

• the new sulfur passivation technique developed in late 80's injects new life into the study of the passivation although the chemical stability of the passivation layer is not so satisfactory.

  八十年代后期出现的硫钝化技术给钝化研究注入了活力，但它的化学稳定性仍不够理想。

• when the passivation layer is deposited at higher temperature, the etch rate of via hole decreased and the via hole size tended to smaller.

  为了提高薄膜晶体管液晶显示器的开口率，研究了在优化的钝化层沉积条件下的过孔尺寸。

• this structure forms the passivation layer against corrosion and wear. the optimum layer against wear improves the resistance of material surface in corrosion, wear and fatigue extremely.

  这种结构形成了抗磨损的优化表面层和抗腐蚀的钝化层，明显改善了材料表面抗磨损、抗疲劳和抗腐蚀特性。

• in the test of breakdown voltage of power transistor with sipos passivation layer before packaging, an abnormal curve of breakdown voltage was found, which was a double-line breakdown voltage curve.

  测试半绝缘掺氧多晶硅（sipos）层钝化的功率晶体管管芯反向击穿电压曲线时，出现异常击穿曲线——「双线击穿」曲线现象。

• instructions: specially designed for cleaning the aluminous surfaces. it will not damage the passivation layer of the aluminum and can keep the original gross.

  产品说明：根据铝材特性，专门设计的配方，经该清洁剂清洗的铝材，表面钝化膜不会受损，并且保持原有的光泽。

• one or more interdigital transducers and a passivation layer can be formed upon the piezoelectric substrate.

  可以在该压电衬底上形成一个或多个交叉指型换能 器和一个钝化层。

• both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).

  钝化层（18）和聚酰亚胺层（22）将最后的互连层（16）和接合焊盘（28）隔开。

• the invention relates to a forming method of a shallow trench, which comprises the following steps of: forming a passivation layer and a graphic resist layer on a semiconductor substrate;

  一种浅沟槽形成方法，包括，在半导体基底上形成钝化层及图形化的抗蚀剂层；

• simultaneously, defects in the passivation layer of the device surface are also increased with the increasing of the baking temperature and also the surface recombination velocity.

  同时芯片表面钝化层内的缺陷数目也在温度作用下增加，引起芯片表面复合速度增加。