this paper describes the maskless wiring formation technology not using photomask and photoresist, development of metal nano particle and nano ink, application of the inkjet method and future theme.
概述了不使用光致掩模和光致抗蚀剂的无掩模布线形成技术,金属纳米粒子和纳米油墨的研究开发,喷墨法的应用和今后的课题。
so the measurement and control in the feature size of photomask can reduce the reject of ic and research on this area is very meaningful.
对掩模特征尺寸及缺陷进行检测可以减少集成电路的废品率,因此开展这方面的研究具有重要意义。
in the manufacture process of integrated circuit(ic), lithography occupy a very important step, and the quality of photomask used in lithography affects the yield of lsi.
光刻是大规模集成电路生产流程中十分关键的一环,而光刻中使用的掩模的质量对大规模集成电路的成品率有很大的影响。
experimenting repeatedly, by our limited equipments we provided the qualified photomask for the study of 3dg460 microwave low-noise transistor.
经过反复实验,在现有设备条件下,为3dg460微波低噪声晶体管的研制提供了合格光刻版。
a real-time white light information processing system using spatial filtering for ic photomask inspection is described.
本文介绍一种用空间滤波检查集成电路光刻掩模的实时白光信息处理系统。
a photomask is an essential component for semiconductor manufacturing and microfabrication.
光掩膜是半导体和精密加工的必要成分。
some industrial applications including micromachining dynodes of photomultipliers, repairing photomask of lithography, fabricating array micro-holes in incandescent filaments, etc. are introduced.
介绍了飞秒激光加工光电倍增管电极,修复光刻掩膜,诱导白炽灯丝阵列微孔等一些工业应用。
the initial experiments on and analysis of sheet resistance, contact, photomask alignment, line width, and correlations between device parameters and dopants have been made.
对薄层电阻、接触、光掩模对準、线条宽度、器件参数与掺杂的相关性等内容进行了初步试验和分析。
this paper describes the maskless wiring formation technology not using photomask and photoresist, development of metal nano particle and nano ink, application of the inkjet method and future theme.
论述了汽车轻量化的意义、表征参量、评价方法、实施路径和方法;轻量化的设计,零部件和构件的功能与材料性能参量的关系以及先进成形技术的应用。
in this paper, the technology guideline and the technology difficulty for next generation photomask processes are discussed, and some pivotal technology resolving projects are also …
本文对下一代光学掩模工艺技术的技术指标和面临的技术困难进行了论述,并对其中一些关键的技术解决方案进行了简要分析。