英汉例句

• moreover, through the intensively thermomechanical analysis of pcba in the process of reflow soldering above, some methods are given to reduce the warpage.

  并通过以上对pcb组件在再流焊过程中受到的热沖击进行比较深入的分析，提出了减小翘曲的方法。

• flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven .

  本发明提供一种用来将汽化的焊剂从回流焊接炉的气体中过滤出来的方法和焊剂管理系统。

• the product has good heat durability that withstands lead-free compatible reflow soldering conditions.

  符合无铅化回流焊接条件，具有耐高温性。

• introducing the general technology requirements for reflow soldering and typical temperature profile and technical parameter of the main control point at the temperature profile.

  介绍了再流焊机的一般技术要求，并给出了典型焊接温度曲线以及温度曲线上主要控制点的工艺参数。

• in the course of the lead free reflow soldering, lead and lead free of reflow soldering affect the quality of product.

  在再流焊无铅化过程中，再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。

• design the stencil as common as possible when designing insert reflow soldering stencil, in order to brief technological process and meet better print effect.

  在设计插件回流焊印刷模板时，应尽可能设计成普通模板以简化工艺流程和满足较好的印刷效果。

• reflow soldering should not be done more than two times.

  回流焊接最多只能进行两次。

• in this paper, development of electronic packages was described briefly first, then the most popular reflow soldering methods were discussed.

  简要介绍了集成电路器件封装的发展，并对正在普遍应用的几种再流焊方法进行了介绍和评述。

• attention questions and measures during bga assembly were analyzed to increase bga assembly quality by bga package, pcb design, solder paste print, place bga, and reflow soldering process.

  从bga的封装形式、pcb的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了bga组装过程中应注意的问题及其预防措施。

• this article expounds the future development of reflow soldering technology according to the changes of technology in smt.

  主要针对s mt技术发生的巨大变化，对再流焊技术未来发展进行了简单的阐述。

• the higher height and the smaller diameter of solder joint are formed by the smaller heating factors of reflow soldering profile.

  回流曲线的加热因子越小，焊接得到的焊点的高度越高，直径越小。

• smd lamp beads, manufactured through full automatic reflow soldering line.

  贴片灯珠，全自动化回流焊生产；

• reflow soldering should be performed one time. if the capacitor has to be reflowed twice, 30 minutes must be layout between each time.

  推荐回流焊只进行一次，回流焊次数如果需要二次，必须相隔30分钟以上；

• furthermore, the soldering process of pcba in the whole infrared reflow soldering stove is modeled by the finite element software, ansys, and is simulated by the three-dimensional modelling.

  此外，利用有限元ansys软件对pcb组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了pcb组件再流焊全过程的三维动态模拟和仿真。

• this work does the process of lead-free reflow soldering under n2 protection, and the solder joint quality has been analyzed statistically.

  通过新制定的氮气保护无铅再流焊工艺，对焊点外观质量进行了统计分析。

• after reflow soldering rapid cooling should be avoided.

  请避免回流焊接后的急速降温。

• design stencil according to requirement of inserter soldering quality and reflow soldering technology.

  根据插件焊接质量的要求，按照回流焊工艺设计印刷模板。