片语

semiconductor wafer fab半导体生产线

compound semiconductor wafer化合物半导体晶片

semiconductor wafer production line半导体晶圆生产线

semiconductor wafer gettering半导体晶片吸除

Semiconductor wafer conveying半导体晶圆输送

semiconductor silicon wafer半导体硅片

semiconductor bonding wafer半导体接合晶圆

semiconductor wafer fabrication lines半导体生产线

semiconductor wafer lapping半导体晶片研磨

英汉例句

• both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips.

  这两种芯片都是先在一张半导体薄片上成批生产，然后再切割成一个个芯片的。

• a performance evaluation system, which consists of shortterm performance indices and long-term performance indices, is presented for scheduling semiconductor wafer production line.

  为了调度具有大规模、多重入、混合型生产等特征的半导体晶圆制造系统，提出一种将基于问题分解的方法与蚁群算法相结合的新的调度方法。

• method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.

  半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。

• semiconductor wafer fabrication witness a rapid growth in recent years due to the booming applications of integrated circuits.

  近年来，随着集成电路应用的日益增长，半导体业得到了快速的发展。

• by adopting the method of the embodiment of the invention, the stability and the production efficiency of the produced semiconductor wafer can be improved.

  采用本发明实施例的方法能够提高生产的半导体晶圆的稳定性和生产的效率。

• semiconductor wafer processing. single or dual chamber, 25-wafer batch processing offers high-performance wafer cleaning, rinsing and drying.

  半导体晶片处理。单或双室，25晶圆批量处理提供高晶片清洁，沖洗和脱水功能。

• a method comprises pre-cooling a first semiconductor wafer outside of a process chamber, from a temperature at or above 15 deg c. to a temperature below 5 deg c.

  一种方法，包括以下步骤：（a）在工艺室之外将第一半导体晶片从15℃或以上的温度预冷却到5℃以下的温度；

• a new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.

  基于智能体技术，提出了芯片制造生产线动态调度新方法，实现了投料调度、工件调度与设备维护调度的集成。

• according to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system(swfs), a dynamic bottleneck real-time dispatching(dbrd) strategy was proposed.

  晶圆制造是半导体制造过程中的一个重要环节，晶圆制造单元的性能直接影响晶圆制造的成本。

• content and methods of shop-floor control in semiconductor wafer fabricati…

  本文介绍了半导体晶圆制造车间层控制的内容及方法。

• to meet the requirement of multi-objective optimization for semiconductor wafer fabrication, a multi-objective optimization dynamic dispatching(modd) rule was proposed.

  为了满足半导体生产线多目标优化要求，提出了多目标优化动态调度规则。

• we present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes.

  本文描述了使用共面微波探针的半导体芯片在片测试技术。

• content and methods of shop-floor control in semiconductor wafer fabrication were introduced compendiously.

  本文介绍了半导体晶圆制造车间层控制的内容及方法。

• based on the classification on the scheduling for semiconductor wafer lines, the modular and reconfigurable framework is proposed.

  在分析半导体生产线调度分类的基础上，提出了组件化可重构半导体生产线调度体系结构。

• srb was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.

  基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的srb进行了仿真验证。

• used for engraving glass, cleaning residue on the sand casting, controlled fermentation, power semiconductor wafer polishing and cleaning corrosion (with hno3 mixed acid).

  用于雕刻玻璃、清洗铸件上的残砂、控制发酵、电抛光和清洗腐蚀半导体硅片（与hno3的混酸）。

• to provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.

  提供了一种用于加热接近头中的流体的设备和方法。

• then, a moulding sealing layer is exerted on the semiconductor wafer so that the upper part of each column-shaped projection in the plurality of column-shaped projections is exposed.

  然后，在所述半导体晶片上施加模制密封层，使得所述多个柱形凸起中的每一个的上部被露出。

• semiconductor wafer manufacturing: batch, semi-automated 25-wafer, single or dual chamber chemical stripping, developing and cleaning tool.

  我公司再生产喷雾溶剂工具：半自动化，25晶圆，单或双室化学剥离，研发及清洁工具。