In order to further improve the properties of tin electrodeposits, a multifunctional sulfate tin plating additive was developed.

为进一步提高镀锡层的性能，研制出一种多功能硫酸盐镀锡添加剂。

Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.

触点电镀：镀镍金的接触面积的锡焊尾电镀。

It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.

结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。

Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.

介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。

Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.

综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。

Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.

介绍了晶纹镀锡中重熔工序的操作要点和安全要求。

Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.

硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。

The research tendency and developing prospect of electroless tin plating are also discussed.

同时对化学镀锡的研究方向和发展趋势进行展望。

Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.

综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。

The invention comprises the following procedures: preplating, etching, chromium plating, washing, removal of hydrogen, hole loosing, washing and drying and tin plating treatment.

本发明包括镀前工序、刻蚀工序、镀铬工序、水洗工序、除氢工序、松孔工序、水洗烘干工序、镀锡处理工序。

Causes for the hydrogen embrittlement during alkaline tin plating of elastic articles were discussed, preventive and remedial measures were presented.

探讨了弹性零件堿性镀锡产生氢脆的原因并提出了预防及消除措施。

Tin coated flake Cu powder was obtained by electroless tin plating with hypophosphite as reducing agent.

采用次磷酸钠作还原剂，在片状铜粉表面化学镀锡，得到片状锡包铜粉。

Pretreatment, silver plating, nickel plating and tin plating of chip components.

应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。

Dry Film Strip: Removes the plating resist exposing the base copper underneath. The plated copper remains, protected by the tin plating etch resist.

去膜：蚀刻后露出的铜箔被蚀去，留下镀上锡保护的线路部分。

The mechanism of electroless tin plating was discussed.

对化学镀锡的机理做了探讨。

The invention relates to a piston ring and a surface spongy tin plating technique thereof.

一种活塞环及其表面松孔镀锡工艺。

Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole.

镀镍前或锡电镀间的阴极接触不良，放电火花将铜材熔成凹洞。

The effects of the composition and controlled conditions of electroless tin plating on the morphology of coatings are investigated.

研究了化学镀锡溶液组成和工艺条件对镀层表面形貌的影响。