die bonder中文,die bonder的意思,die bonder翻译及用法

2026-05-06 01:42 浏览次数 19

die bonder

英[dai ˈbɔndə]美[daɪ ˈbɑndɚ]

芯片焊接机;模片结合器,裸片结合器

die bonder 例句

英汉例句

  • The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.

    实验结果表明:所设计的机构能满足IC芯片粘片机的工作要求,各项性能指标均达到了设计标準。

  • An experimental platform of the IC die bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.

    设计制造出IC芯片粘片机焊头机构的实验平台,采用图像处理的方式来测量焊头的运动精度和定位精度等参数。

  • This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.

    本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理,并给出了主要设计参数和计算公式。

  • The image recognition system is the key component of realizing the automation of LED die bonder as well as its difficult part.

    图像识别系统是实现LED粘片自动化的关键部分,也是其难点。

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