The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.
实验结果表明:所设计的机构能满足IC芯片粘片机的工作要求,各项性能指标均达到了设计标準。
An experimental platform of the IC die bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.