die bonding中文,die bonding的意思,die bonding翻译及用法

2026-05-06 01:42 浏览次数 18

die bonding

英[dai ˈbɔndiŋ]美[daɪ ˈbɑndɪŋ]

钢模结合;小片接合;芯片焊接;模片键合

die bonding 例句

英汉例句

  • the thermal resister of power led is analyzed in this paper. using the silver paste and epoxy resin as die bonding materials, two kinds of power leds are made.

    分析了功率型led热阻系统的构成,对采用银浆和环氧胶作为芯片键合材料的功率型led热阻进行了对比研究。

  • die bonding plays a key role in effecting the quality and efficiency of ic production. the rapid development brings a challenge to the system in utmost stroke, speed, acceleration and accuracy.

    芯片封装是影响ic制造产品性能和生产效率的关键环节,芯片封装等领域的迅速发展对定位系统的行程、速度、加速度和精度的极限性提出挑战。

  • using the silver paste and epoxy resin as die bonding materials, two kinds of power leds are made.

    分析了功率型led热阻系统的构成,对采用银浆和环氧胶作为芯片键合材料的功率型led热阻进行了对比研究。

  • the die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.

    半导体封装粘结工艺养护过程要求炉内温度均匀分布,现有养护炉不能满足这一要求。

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