片语

flip-chip technology倒装式芯片技术

Flip-chip Substrates倒装芯片基片

flip-chip configuration倒装焊结构

flip-chip ic倒装芯片集成

flip-chip attach芯片装配

FLIP-CHIP MOUNTER全自动高速倒装机

flip-chip bonding倒装焊接

flip-chip transistor[电子]

英汉例句

• the key tech-nologies of flip chip technology are that redistribution technology, under bump metallurgy(ubm), bump technology, reflow technology and underfill technology.

  倒装技术是发展的关键技术，它包括再分布技术、凸点底层金属（ubm）技术、凸点制备技术、倒扣焊接技术和底部填充技术等。

• in addition, this paper also studys, the 3 major supporting technologies of flip chip bonding technology, for their development would largely impact, the promotion and application of fcb in mcm.

  另外，由于芯片倒装焊接的三种关键支撑技术的发展在很大程度上影响着mcm中倒装焊接技术的普及应用，本文还对三种支撑技术进行了研究。

• this article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.

  利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。

• the embedded active chip also can be realized by backside thinning and flip chip bonding.

  通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。

• the dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

  研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。

• with optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.

  本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。

• description: 6-channel emi filter with protection in flip chip bga;

  中文描述：6声道的emi滤波器的保护措施倒装芯片bga封装；

• this paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.

  介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。

• the system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.

  该系统可以处理直径多达200毫米的晶片，包括模具的倒装。

• the process of flip chip based on aluminum nitride is studied.

  研究了以氮化铝为基板的倒扣封装的工艺。

• it was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

  证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。

• with the doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.

  采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。

• flip chip on board (fcob) has been used widely as a microelectronics packaging structural form.

  板上倒装芯片（fcob）作为一种微电子封装结构形式得到了广泛的应用。

• electromigration induced cu dissolution in flip chip packages the phenomenon of cu dissolution induced by electromigration at flip chip solder joints is reported.

  覆晶封装中电迁移效应导致之铜溶解现象本论文报导覆晶封装之焊点中电迁移所引起之铜垫层快速溶解现象。

• also, dsc is employed to obtain the thermal deformation field of the assembly structures of flip chip on ceramic substrate, especially for the strain concentrating area around the solder joints.

  在电子封装结构的热变形分析中也引入了数字散斑相关技术，测量了封装结构中焊点附近区域的变形分布，显示出在焊点位置产生了由热变形不协调引起的变形梯度的高度集中。

• lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages.

  集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；

• lead in solders to complete a viable electrical connexxxon between semiconductor die and carrier within integrated circuit flip chip packages.

  集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；

• bp303is a product developed for the flip chip and fob bonding.

  是专门为倒装芯片和邦定结合开发的产品。

• lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages.

  集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。

• the capability for accurate placement will continue to be important as chip scale packages and flip chip technology reduce pin pitches even further in the unending race for product miniaturization.

  为了能够满足产品小型化的要求，能够降低引脚针间距的芯片规模封装和倒装芯片技术，将永无止境地向前发展，精确贴装的能力将继续是一个非常重要的因素。

• thedrain saturation current is increased 10% after bonding. to disperse heat of ganhemt, this flip chip bonding method seems to be simple and effective.

  实验结果表明，这种改进的倒装焊技术可以使hemt 器件的饱和漏极电流提高10%。

• an ic chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

  ic芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。

• this paper talks about the major supporting technologies for mcm package : the interlinkage of chips, flip chip bonding, flip bonding .

  本论文研究了mcm中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。