lead-free solder
无铅钎料
2026-03-21 16:55 浏览次数 12
无铅钎料
lead-free solder bar is one kind of environmental-friendly product with good stability.
无铅锡条是一种环保型,稳定性很好的产品。
this paper describes the development trend of low melting point and high melting point type lead-free solder paste.
概述了低熔点和高熔点型无铅焊膏的开发动向。
from the concept of environmental protection, the necessity of using lead-free solder was introduced.
从环保概念出发,介绍了使用无铅钎料的必要性;
so it is necessary to study lead-free solder joint's reliability under cyclic stretch and impact.
而循环拉伸能很好的模拟实际的振动,因此,研究循环拉伸载荷下焊点的可靠性是很有必要的。
so study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
application: for with lead and lead-free solder casting.
适用范围:有铅及无铅焊料锡条等的浇铸。
to have lead tin line, tin bar and lead-free solder bar for line, the main products of excellent quality, china-largest of international brands.
以有铅锡线、锡条和无铅锡线、锡条为主要产品,倾力打造质量优良的国际品牌。
tin-copper-nickel system is a lead-free solder of good performance, which is widely used in the lead-free welding process of electronic products.
锡-铜-镍体系是一种综合性能良好的无铅焊料,被广泛应用在电子产品的无铅焊接工艺中。
the apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
该装置(1)可使溶出于包 含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
application: for with lead and lead-free solder billet casting.
适用范围:有铅及无铅焊料棒等的浇铸。
therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此,电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
here recent achievements on the lead-free solder were presented in view of joint manufacturing and structural reliability.
本文从焊料可焊性和焊接结构的可靠性等方面介绍了近年来国内外无铅焊料研究方面的最新成果;
the ameliorative conditions of the supersonic atomizing equipment of producing lead-free solder powder are found.
找出了无铅焊锡微粉工业生产设备要满足的基本条件。
through research, choose one or two lead-free solder paste.
通过研究,选择一种或两种无铅锡膏。
in order to predict failure location of bga lead-free solder joints under a drop impact, abaqus software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(bga)封装中无铅焊点的失效,采用abaqus软件来模拟跌落碰撞过程中焊点的应力分布。
the factors affecting soldering ability of rosin-based flux for lead-free solder paste , and the factors affecting erosion resistance are discussed.
实验结果表明,松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。
circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.
氮气循环使用,增加无铅焊料的侵润性和流动性,使锡点饱满光亮。
progress of lead-free solder is presented in this paper.
本文就无铅焊料的发展进行论述。
the solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (smt).
随着微电子表面组装技术的迅猛发展,软钎料尤其是无铅钎料逐渐成为研究的焦点。
at last, the progress trend of lead-free solder is pointed out.
最后指出了无铅焊料的发展趋势。
each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.
每个艺术花盆都是定制的。 它们由手工制作的玻璃和无铅焊料接合而成,交付使用时,万事俱备,只欠花卉。
other effects of lead-free solder paste demolding performance factors such as having a mesh size and aspect ratio.
其它感化无铅焊膏脱模本能机能的成分包含网孔尺寸和宽矮比。
recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
回收废锡料:无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。