With the development of microelectronic packaging technologies, anisotropic conductive adhesives (ACA) are widely used as one kind of the green materials in the electronic interconnection.
随着微电子封装技术的发展,各向异性导电胶作为一种绿色的连接材料,广泛应用于电子产品中。
So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
为此,必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术,这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
Using self-assembly in microelectronic packaging technology, huge advantage can be gained to satisfy the market requirements of sophisticated electronic devices.
将自装配技术用于微电子封装之中,可有效提高技术的先进性,顺应现代社会高端电子产品的需求。