the evolution of microelectronics packaging is briefly reviewed.
简要回顾了微电子封装的发展历程;
microelectronics packaging machine control technology used in japan to achieve a safe and unmanned operation, high productivity, greatly enhance the international competitiveness on the market.
日本用微电子技术控制包装机,达到安全性高、无人操作、高生产率,大大提高了国际市场竞争能力。
the reliability of solder interconnection joint is one focal subject in the development of microelectronics packaging and assembly technology.
互连焊点可靠性是微电子封装与组装技术发展中受到普遍关注的课题。
flip chip on board (fcob) has been used widely as a microelectronics packaging structural form.
板上倒装芯片(fcob)作为一种微电子封装结构形式得到了广泛的应用。