2026-03-21 20:12 浏览次数 17
微波多芯片组件
Packaging and Disassemble Technology of Irregular Shapes Module of Microwave MCM
异型微组装微波组件的可拆卸密封技术
Microwave Characteristics of Bonding Interconnects in LTCC Microwave MCM
LTCC微波多芯片组件中键合互连的微波特性