photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board.
感光性树脂组合物,感光性元件,光致抗蚀图形的形成方法及印刷电路板的制造方法。
the adhesive sheet (5) for fixing the flexible printed wiring board (4) to the fixing sheet (6) has a pressure-sensitive layer at least on one side of its porous base.
将柔性印刷电路(4)固定在固定板(6)上的胶粘剂片(5)在其多孔基材的至少一侧具有压敏胶粘剂层。
a metal composite film that excels in heat resistance and adhesion, being suitable for use in a flexible printed wiring board capable of minute wiring formation; and a process for producing the same.
本发明公开了耐热性和粘合性优异的可以形成微细布线的适于挠 性印制线路板的金属复合膜及其制造方法。
other core activities are fire and safety testing of cables, and quality evaluation and failure analysis of printed wiring boards and electromechanical components.
其他的主要服务是提供线缆产品的防火及安全测试,线路板产品和电化学零部件产品的质量评估及失效分析。
the feasibility of the application of polyvinyl alcohol (pva) to printed wiring board was studied.
研究了pva在电路板印刷中的应用可行性。
multilayer printed wiring board, method for manufacturing buildup printed wiring board, and electronic apparatus.
多层印刷线路板,积层印刷线路板的制造方法,和电子设备。
advanced packaging technology represented by csp and the development of build up-type multilayer printed wiring board(pwb)that make such high-density packaging possible are making greatly progress.
以csp为代表的先进封装技术和可以实现高密度封装的确积层多层板的开发已经取得了很大的进步。
arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an ic chip (90) and the chip capacitor (20) and to reduce the loop inductance.
因为在印刷布线板10内设置了片状电容器20,所以能够缩短ic芯片90与片状电容器20的距离,降低环线电感。
conventional printed wiring boards (pwbs) are not satisfactory substrates for lcccs because the mismatch in thermal coefficient of expansion (tce) causes solder joints to crack.
普通印制板(pwb)对于无引线陶瓷芯片载体不是满意的基板,因为热膨胀系数(tce)不匹配能引起铅焊处开裂。
the pcqr2 database provides a statistically valid means to compare and contrast the capability, quality, and relative reliability of printed wiring board fabricators.
pcqr2数据库提供了一种有效的统计方法,可以用来比较和对照各电路板制造商在制程能力、品质以及相应可靠性方面的差异。
therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.
由此,得到一种层间连接部被压缩且具 有高连接可靠性的多层印刷线路基板。