with the development of vlsi, cd and flat panel display (fpd), the demands of sputtering target materials with super high purity are greatly increased in it.
由于集成电路、光碟及平面显示器等产业规模越来越大 ,这些高技术产业对各种超高纯金属及合金溅射靶材的需求量愈来愈多。
the invention relates to a device for improving utilization rate of a high vacuum ion beam sputtering target material.
本发明涉及一种高真空离子束溅镀靶材利用率增强装置。
the traditional upper limit of magnetic induction density b parallel to target surface in rectangular planar magnetron sputtering target has been increased by analyzing, designing and experimenting.
通过理论分析、实际设计和实验,对矩形平面磁控溅射靶表面水平磁感应强度b的传统取值上限进行了拓展。
to improve the uniformity of sputtered coating, the density of sputtering target must be over 99.7%.
为了提高溅射层的均匀性,要求溅射靶材具有较高的致密度(在99.7%以上)。
the thickness uniformity of films deposited by planar magnetron sputtering target was analyzed theoretically.
从理论上分析了平面磁控溅射靶沉积薄膜的厚度均匀性。
embodiments of the invention provide a method of welding sputtering target tiles to form a large sputtering target.
本发明提供一种焊接溅镀靶材以形成一大的溅镀靶材的方法。
a new net-shape cathode sputtering target which has a simple structure and a high sputtering rate was put forward.
设计了一种网状阴极溅射靶,它是由多个空心阴极并列交叉组合而成。
a new multiple hollow cathode sputtering target which has a simple structure and a high sputtering rate, was put forward.
研制了一种由多个空心阴极并列组合而成的可直接作为溅射靶的多重空心阴极溅射靶。
sputtering target is usually made of pure molybdenum sheet.
而溅射靶材多以金属纯钼板材为主。