2026-03-22 11:16 浏览次数 25
堆叠芯片
Effect of Geometrical Nonlinearity on Warpage Prediction of Matrix Stacked Die BGA During Assembly Process
集成工艺中叠片BGA阵列翘曲的几何非线性预测分析
Failure Analysis and Thermal Stress Simulation in a Stacked Die Package
芯片叠层封装的失效分析和热应力模拟