片语

surface-mount gas表面安装用气体

surface-mount shower head明装淋浴花洒

leadless surface-mount component无引线表面组装元件

Surface-Mount Device表面安装器件

leaded surface-mount有引线表回组装元件

Surface-Mount Fuses表贴式保险丝

Surface-mount components装元件

plastic surface-mount package表面黏着封装

Surface-Mount LED安装LED

英汉例句

• Project wireless channel receiver aimed at is a part of a mobile communication system. A number of monolithic microwave integrated circuits (MMIC) and surface mount components are used.

  本文介绍了一种用于野战移动通信系统的宽带微波信道接收机，采用单片微波集成电路(MMIC)实现。

• For mobile communications, computers, various consumer electronics, automotive electronics and other electronic devices, surface mount DC or pulsing circuit.

  适用于移动通讯、计算机、各种消费电子、汽车电子等各种电子设备的表面贴装直流或脉动电路。

• Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surface mount process for the solder joint quality control was presented.

  提出了MEWMA控制图参数优化方法，对电子产品装配中的表面贴片工艺过程的焊点质量控制进行了研究。

• In surface mount processes, stencil printing plays an important part, and the control has effect on the quality of assemblies.

  表面安装工艺流程的关键工序之一就是焊膏印刷，其控制直接影响着组装板的质量。

• Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.

  表面贴装印制板设计直接影响焊接质量，将专门针对表面贴装印制板的焊盘设计、布线设计、定位设计、过孔处理等实用技术作一些探讨。

• Through hole components welding using traditional manual welding or soldering. The circuit board surface mount components and through-hole components mixed together.

  传统的通孔元件的焊接采用波峰焊或手工焊接。目前电路板上表面贴装元件和通孔元件混合在一起。

• The ACS706 is provided in a small, surface mount SOIC8 package.

  ACS706以体积小、表面安装的SOIC 8封装的形式提供。

• A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.

  介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。

• The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).

  随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。

• In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.

  表面贴装，钢网是锡膏準确重复印刷的关键。

• To meet the 2008 Olympic Games, 「downsizing」 plan, Liard developed a surface mount dual color displays, a lot of time for the training center and game scoring.

  为了适应2008年奥运会的「瘦身」计划，利亚德开发了表面贴装双基色显示屏，大量用于训练馆和比赛计时计分系统。

• Spherical contact on display, one of surface mount package.

  球形触点陈列，表面贴装型封装之一。

• Encapsulated surface mount electronics provide resistance to water, oil, dirt, high temperatures, shock and vibrations and overall harsh environments.

  表面贴装电子封装提供抗水，油，灰尘，高温，沖击，振动和整体恶劣环境。

• The wave soldering process may advance welding on the surface mount components damage.

  采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。

• The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.

  建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。

• RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.

  又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。

• The wave soldering process may advance welding on the surface mount components damage. Now a lot of circuit board with surface mount components.

  采用波峰焊工艺可能会对先期焊接的表面贴装元件造成损伤。现在很多电路板上以表面贴装元件为主。

• It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.

  它提供了在任何现有的表面上的最高权力能力和最低的导通电阻封装。

• With the rapid development of surface mount technology, new packaging technologies arise continually and area array packaging technology becomes the issue of contemporary package.

  随着表面安装技术的迅速发展，新的封装技术不断出现，面积阵列封装技术成了现代封装的热门话题。

• Purpose: General purpose amplifier for surface mount applications.

  用途：适用于表面贴装的一般放大电路。