片语

thermocompression founding热压铸

thermocompression distillator热压缩式蒸馏器

thermocompression bonder[机]

thermocompression bond热压焊

thermocompression bondingThermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.

thermocompression technical热压工艺技术

thermocompression system蒸汽加压制盐法

thermocompression evaporation热压缩蒸发

thermocompression evaporator热压缩蒸发器

英汉例句

• the paper constructs a correlation formula for the pressure gradient and geothermal gradient in the lithosphere with the thermocompression coefficient.

  与地温梯度一样，巖石圈中的地压梯度在空间和时间上也应是复杂多变的。

• the porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.

  利用该多孔纳米结构作为键合层，由于纳米尺度效应，可以在较低的温度和压力下实现热压键合。

• an elongation amount of electronic parts to be bonded onto a substrate by thermocompression is accurately controlled, and thereby poor connection of the electronic parts is prevented.

  本发明涉及在底板上压接电子部件的电子部件压接装置及方法。通过正确控制要热压接到底板上的电子部件的延伸量，可防止电子部件的接触不良。

• a novel instrument of silicon chip thermocompression outer wire bonding and jointing process research;

  该方法应用于快速测定键合硅铝丝中的各种元素，结果满意。