片语

using wafer bonding硅片键合

Wafer Copper Bonding Method晶圆铜接合方式

wafer direct bonding w db晶片直接键合

si-wafer direct bonding硅片键合

silicon wafer direct bonding technology硅片直接键合技术

low temperature wafer direct bonding圆片低温键合

英汉例句

• without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.

  晶圆键合可以使得经过抛光的半导体晶圆在不使用粘结剂的情况下结合在一起。

• introduces wafer bonding process, technical requirements, application choice and interaction for mems, and showing mems fabrication technology and application prospects.

  介绍了晶圆键合工艺、技术要求、应用选择以及对mems的作用；展示了mems制造技术和应用前景。

• the principle and approaches of wafer bonding technology is described, followed by discussion of the main limitations to realize longwave vertical cavity devices.

  叙述了晶片键合技术的发展概况、基本原理和基本方法，分析了实现长波长垂直腔型器件的难点。

• three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.

  介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。

• a silicon wafer bonding technology and its application to new dielectric isolation combined with conventional v-shaped grooves are described.

  本文介绍了将我们开发的硅片粘合技术与传统v形槽隔离工艺相结合而研制成功的一种新的介质隔离方法。

• furthermore, specific introduction is given to the applications of wafer bonding technology in microelectronics.

  最后着重介绍了晶片键合技术在微电子学领域中的应用。

• a perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.

  穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。

• an equipment for vacuum wafer bonding was developed based on the wafer bonding technology.

  基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。

• this paper introduces the technology of solid membrane transfer by wafer bonding and its applications.

  阐述了利用键合方法转移薄膜材料的技术及其应用。

• according to the present invention, defects of traditional wafer bonding process can be avoided.

  本发明可避免传统晶片粘合工艺的缺点。

• direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

  晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。