a solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining(edm) and electric chemical machining(ecm) technique.
提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。
wafer slicing would increase to 500mw by the end of the second quarter, with further capacity expansions in the planning stage.