in this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.
本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。
with teflon seal cylinder, glass insulators, ball bonding and tin soldering, cak35 hermetically sealed wet tantalum capacitor has no electrolyte leaking.
golden ball bonding (gbb) process is an important process for head gimbal assembly (hga) production.
金球焊接是生产磁头臂悬架组件的一道重要工序。
from the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.