英汉例句

• the predicted deflection errors for the partially covered cpua by the deflection model neglecting the bonding layer are obviously larger than those for the half covered cpua.

  忽略粘结层影响的情况下部分覆盖圆形压电单晶执行器挠度模拟误差明显大于半覆盖圆形压电单晶执行器挠度模拟误差；

• this paper shows that the shear stress distribution in bonding layer has similar characteristics as the strain distributions near the ends of the actuator.

  通过分析可得，粘贴层剪切应力的分布与致动器端部附近的应变分布有相似的特征。

• the bonding layer between the enamel coating and the base metal was formed by means of wetting, spreading and reaction of the molten frit on the metal surface.

  喷瓷层与金属的密着是热喷玻璃釉料熔体在基体表面上润湿、铺展和界面反应形成的。

• the bonding layer is adhered between the first chip and the second chip.

  粘着层粘着于第一芯片与第二芯片之间。

• the distributed force model of intelligent beam structures is presented considering the effect of bonding layer on the basis of theory of linear strain.

  以线性应变理论为基础，提出了考虑粘贴层影响的智能结构梁分布力模型。

• in this paper, the tension bending coupling model is presented by virtual work principle, the effect of the bonding layer between beam and piezoelectric actuator is considered in the analysis.

  利用虚功原理，建立了单面粘贴有压电致动器的梁结构的拉伸-弯曲耦合模型，在分析过程中，考虑了梁与致动器之间粘贴层的影响。

• as results, the actuation force of piezoelectric actuator is estimated excessively when the effect of the bonding layer is not considered.

  结果表明：忽略粘贴层的影响，将过高地估计压电片产生的驱动力；

• it is shown that the shear stress distribution in bonding layer has similar characteristics to the strain distributions near the ends of the actuator.

  通过分析可得，粘贴层切应力的分布与致动器端部附近的应变分布有相似的特征。

• the piezoelectric actuators are pasted to main structure by the bonding layer to transfer the strain and to achieve the control of the structure.

  压电驱动器应用时要通过胶粘剂与主体结构固结，达到传递应变，实现控制结构变形的目的。

• the distributed force model of intelligent beam structures is presented in considering the effect of bonding layer on basis of hypothesis of linear strain in the paper.

  基于线性应变假设，提出了考虑粘贴层影响的智能结构梁分布力模型。

• theoretically speaking, it is reasonable that the static deflection model for cpuas considering the influence of the bonding layer can accurately model the deflections of cpuas.

  如果在建模的过程中考虑粘结层应该能更精确模拟圆形压电单晶执行器的挠度变形。

• if the bonding temperature is too high, the thermal stress in the bonding layer may cause die or bond cracking.

  焊接温度过高，则焊层内会出现较大的热应力，可导致芯片或焊层开裂；