英汉例句

• The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.

  器件键合失效主要表现为温度试验后管壳上的键合点脱落，而引起失效的原因与工艺过程和键合所涉及的材料有关。

• The optimum bonding process was given.

  确定了最佳粘接工艺。

• The influences of surface treatments, the pressures during bonding process and the thickness of adhesive layer on shearing strength were investigated with epoxy resin-DDS curing system as adhesive.

  采用环氧树脂-DDS固化体系作为胶接剂，探讨了各种金属表面处理方法、胶接时对胶接面施加的压力、胶层厚度等因素对胶接剪切强度的影响。

• The successful bonding process flow divides into five stages with temperature increasing. Surface energy value calculated based on the model is in agreement with the experimental results.

  首次提出五阶段键合模型计算值与实测表面能曲线相一致，初步确定了键合过程中界面发生的微观反应机理。

• The technological requirement and bonding process for SC and SD type of cylindrical sleeves were introduced.

  介绍了SC型和SD型筒形砂套技术要求及制作工艺。

• According to the present invention, defects of traditional wafer bonding process can be avoided.

  本发明可避免传统晶片粘合工艺的缺点。

• The characteristics of bonding force in the ultrasonic bonding process were also studied.

  在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。

• Earlier aluminum frames used a bonding process that glued the tube into a lug.

  此前使用的铝框粘合胶过程的管成耳。

• Based on the experimental results, the models of the ultrasonic wedge bonding process and the interfacial bonding characteristics were illustrated.

  给出了超声楔形键合接合过程和界面特征的模型。

• In this paper, research results and disadvantages of main bonding process of zircaloy and stainless steel are reviewed.

  分析了核反应堆用锆合金与不锈钢主要连接技术的研究结果及存在的问题。