片语

刷镀铜

copper pyrophosphate plating

An analytical procedure and calculation method on the content of copper, total pyrophosphate, phosphate and ammonium citrate in pyrophosphate copper plating bath were give

cyanide copper- plating氰化镀铜

zinc copper alloy plating电镀黄铜

copper immersion plating浸铜

Copper-plating solution镀铜药水

copper-plating process镀铜工艺

copper immersion plating solution浸铜液

英汉例句

• the reaction of chemical replacement copper plating on iron surface and profile of the coating have been investigated by electrochemical methods and scan electron microscopy.

  用电化学方法和扫描电子显微镜研究了钢铁置换镀铜反应及镀层形貌，结果表明：钢铁表面的置换铜镀层总是多孔的。

• the effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.

  探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。

• the selection of temperature-measuring probe, cooling device, agitator and direct current supply for bright acid copper plating process was described.

  介绍了光亮酸性镀铜工艺用测温探头、冷却设备、搅拌装置和直流电源的选择。

• copper sulfate in acid copper plating bath was determined by spectrophotometry with edta as chromogenic agent.

  用edta作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。

• the absorption spectrum and copper deposition rate of a given chemical copper plating solution affected by different surfactants and polar organics were investigated.

  研究了固定的化学镀铜基础配方在表面活性剂与极性有机物作用下的吸收光谱和沉铜速率；

• experimental study was carried out on the preplafing technology of acidic copper plating for iron and steel.

  本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。

• the invention relates to a nickel plating technology for aluminum alloy that includes zinc-depositing, copper plating and nickel plating processes.

  本发明涉及一种给铝合金材料镀镍的工艺，具体的讲涉及一种给铝合 金灯头、灯座上镀镍的工艺流程。

• in this paper, the inhibition treatment of the copper plating wire used in co 2 gas shielded arc welding is dealed with.

  对二氧化碳气体保护焊镀铜焊丝进行了缓蚀处理试验。

• the processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.

  研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。

• cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.

  利用比浊法，以op乳化剂作为稳定剂测定酸性镀铜液中的氯离子。

• especially in, high-end radiator electroplating, in acid, nickel plated copper plating nickel etc, black has a wealth of experience in production practice, plating industry area is the lead.

  尤其在中、高端散热器电镀方面，在酸性镀铜、镀镍、黑镍等有着丰富的生产实践经验，在电镀行业领域具有领先地位。

• results showed that the conductive performance of glass fiber with copper plating increased greatly so that the material could use as electromagnetic shield.

  研究表明，玻璃纤维化学镀铜后，可提高导电性能，并用作制备电磁屏蔽材料。

• the equipment configuration for bright acid copper plating was discussed in detail based on the technological features of brightening agents used in different systems.

  本文结合不同体系光亮剂的工艺特点，对光亮酸性镀铜的设备配置进行了较为详细的讨论。

• the results show that the double zine dip process does not need cyanide copper plating for bottom plate;

  结果表明，以二次浸锌法进行预处理，无需氰化镀铜打底；

• a novel technology of acidic electroless copper plating on steel matrix was studied in this paper.

  研制了一种新型的钢铁基件酸性化学镀铜工艺技术。

• because of lower plating temperature, this method is very advantageous to electroless copper plating for surface of abs plastic.

  在该条件下施镀，镀速快、可镀厚铜、镀层光亮、镀液稳定，且由于施镀温度较低，极有利于在a b s表面施镀。

• copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit.

  电镀铜层具有良好的导电、导热、延展性等优点，因此，电镀铜技术被广泛应用于电子材料制造领域。

• a kind of composite additive used for copper plating of chemical replacement on iron surface was investigated.

  研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。

• though galvanisation is often done by dipping steel in liquid zinc, it is sometimes done by electrolysis—nickel and copper plating are normally done this way.

  尽管一般是通过液态锌蘸洗钢铁来镀锌，有时候也会用电解的方法，在电镀镍和铜时就通常使用电镀。

• firstly, the complex decoy is prepared by the means of electroless chemical silver plating and copper plating on the surface of nitrocellulose substrate.

  在诱饵剂的制备方面：首先选用硝基纤维素片作为复合诱饵剂的基片，实施化学镀银和化学镀铜实现了复合诱饵剂的制备。

• thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.

  因此，用钯导电体层形成溶液将工件转变成导体，所述溶液是中性的，不使用高堿性无电镀铜溶液。

• a study on the technology of electroless copper plating with sodium hypophosphite as reductant;

  以次亚磷酸钠为还原剂 ，在压电陶瓷表面进行酸性化学镀镍磷。

• this work optimized the recipe of alkaline electroless copper plating with formaldehyde(37%) as reducing agent and edta as complexing agent.

  优化了以甲醛为还原剂，edta为络合剂的堿性化学镀铜的基本配方。

• the inner anode and its choice for copper plating on stainless steel was emphatically introduced.

  重点对不锈钢镀铜的内阳极及其选择作了介绍。

• the factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated.

  结果表明，优选出的的镀液稳定性相对较高、沉铜速度快、镀层外观较好。