the die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半导体封装粘结工艺养护过程要求炉内温度均匀分布,现有养护炉不能满足这一要求。
a brief analysis is given of the vertical radiant curing oven drying system with oil-heated air circulation and water-cooled air curtain used for manufacturing impregnated glassfibre fabrics.