the necessity of developing full auto dicing saw is discussed according to development status of microelectronic industry.
根据微电子工业的发展现状,论述发展全自动划片机的必要性;
the automatic alignment technique is a key part in the development of ic packaging equipment, which brings the dicing saw new bright spot contrast to the general saw.
自动对準技术是集成电路后封装设备中的一项重要单元技术,是全自动划片机与普通划片机的最大区别之一。
the design method and way for control program of hp-801automatic dicing saw is introduced in the paper. it approaches a path to design control program in semiconductor manufacturing equipment.
主要阐述了hp-801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。