英语释义

• a conductor made with semiconducting material

片语

semiconductor instrument半导体器件

Semiconductor-Device Electronics半导体器件电子学

semiconductor function device半导体功能器件

Semiconductor storage device发明名称

Semiconductor optoelectronic device半导体光电子器件

semiconductor refrigerating device半导体致冷器件

semiconductor EL device半导体电致发光

Semiconductor memory device发明名称

semiconductor photoelectric device半导体光电器件

semiconductor switching device[电]

英汉例句

• thus, a thin-film semiconductor device operating with high mobility without being adversely influenced by, for example, electron scattering at the grain boundaries during the operation.

  该器件能够获得高迁移率的工作，而不会受到晶粒边界处电子散射等现象的干扰。

• disclosed herein is a method for forming an interlayer dielectric film for a semiconductor device by using a polyhedral molecular silsesquioxane.

  此处公开了一种使用多面体分子倍半硅氧烷形成半导体器件所用的层间电介质膜的方法。

• transistor: solid-state semiconductor device for amplifying, controlling, and generating electrical signals. invented at bell labs (1947) by john bardeen, walter h. brattain, and william b.

  晶体管：用于放大、控制和生产电信号的半导体器件，是贝尔电话实验室的三位美国物理学家巴丁、布喇顿和肖克莱于1947年所发明；

• a semiconductor device includes first layer wiring including a gate electrode mounted on a substrate;

  一种半导体器件，包括：第一层配线，其包括被安装在衬底上的栅极电极；

• the solution using a spline procedure, sadi, and a high-order compact finite difference(hoc)method is presented for the hydrodynamic(hd)model for semiconductor device simulation.

  采用样条分步法sadi与高阶紧致差分相结合的方法，计算用于半导体器件模拟的流体力学模型。

• as a main packaging equipment of the semiconductor device production system, its developmental tendency is high-speed, more intelligent and more reliable.

  编带机作为半导体器件生产系统中的一种重要包装设备，发展趋势为高速化、智能化和高可靠性。

• the semiconductor device includes a semiconductor substrate having an active region and a device isolation region defining the active region, and a resistor string formed over the active region.

  该半导体器件包括具有有源区和限定了有源区的器件隔离区的半导体衬底，以及形 成于有源区上方的电阻串。

• a method is provided for testing a semiconductor device that includes both a digital (310) and analog (320) portion.

  本发明提供一种用于测试包含数字部分（310）和模拟部分（320）两者的半导体装置的方法。

• a fluid heater for a semiconductor device is …a transparent tube (409) disposed being distanced …

  为半导体器件液体加热器是提供均匀加热气，从而提高…

• the present invention also provides methods of manufacturing a semiconductor device including forming a metal oxide layer and a first conductive layer on a substrate;

  制造半导体装置的方法包括在基板上形成金属氧化物层和第一导电层；

• the invention provides a semiconductor device which can increase heat diffusion efficiency generated by a plurality of semiconductor chips, and connects with a heat diffusion path reliably.

  本发明提供一种半导体装置，提高了从多个半导体芯片产生的热的扩散效率，并可靠地与散热路径连接。

• this course also serves as the introduction course for other advanced semiconductor device courses.

  同时本课程其他高等半导体器件课程提供基础。

• a method is described for fabricating and antifuse structure (100) integrated with a semiconductor device such as a finfet or planar cmos devise.

  本发明提供了与如finfet或平面cmos器件的半导体器件集成 的反熔断器结构（100）及其制造方法。

• accordingly, a semiconductor device which is composed of conductivity type transistors that are identical and which is not affected by a noise and a display device including it are provided.

  由此，提供包括相同导电型的晶体管的、能够降低噪声的影响的半导体装置和具备该半导体装置的显示装置。

• the paper describes the essential configuration and characteristics of a novel power semiconductor device bsit, discusses the drive of bsit, and gives bsit dc converter circuit.

  介绍了一种我国首创的新型电力半导体器件bsit的基本结构和特性；讨论了bsit的驱动问题；

• a lower igbt and an upper igbt are excellently and firmly bonded by solder, the lower igbt and a wire are firmly connected, and a highly reliable semiconductor device is formed.

  能够通过焊锡良好地固定下部igbt和上部igbt，同时牢固地连接下部igbt和引线，形成可靠性高的半导体器件。