英汉例句

• This paper analyzes the carrier non local transport model of small size semiconductor devices and studies the influences of nonsymmetrical band structure and heterogeneous effect on emphasis.

  系统分析了小尺寸半导体器件中的载流子非本地输运模型，重点研究了非均匀能带结构和异质结效应对输运电流密度的影响。

• With the rapid development of microelectronics, the feature size of semiconductor devices is becoming smaller and smaller as predicted by Moore「s Law.

  随着微电子技术的飞速发展，半导体器件的特征尺寸按摩尔定律不断缩小。

• This paper introduces how to produce high quality polysilicon film in the semiconductor devices and how to monitor the deposition temperature at the same time when film grows.

  本文介绍了半导体器件中的优质多晶硅薄膜的生长以及在生长多晶硅薄膜的同时怎样来监控淀积温度；

• The reliability of semiconductor devices is very important, especially in space applications.

  半导体器件的可靠性至关重要，？特别是在空间技术应用中尤其如此。

• This module introduces the characteristics of semiconductor devices in a range of linear applications.

  这个课程模块介绍了线性放大器范围中的半导体器件的特征。

• The lamps」 small size makes them comparable to light -emitting diodes but the new lamp generates much brighter light than those semiconductor devices do.

  凯若维森灯的小巧外形与发光的二极管相似，但前者比那种半导体装置发出的光更加明亮。

• The noise components estimation of semiconductors is the precondition of reliability screening of semiconductor devices using noise measurement.

  半导体的噪声成分估计是利用噪声进行器件可靠性筛选的前提条件。

• As the important part of semiconductor devices industry, the semiconductor integrated circuit standards have profound influence on the development of the electronic and electric industry.

  半导体集成电路是半导体器件两大产业之一，对电子电气产业发展有着重要影响。

• Thermistors are semiconductor devices whose resistance varies with temperature.

  热敏电阻是一种半导体元件，它的电阻随温度而变化。

• The accomplishments have been applied to developing of semiconductor devices and circuits in recent years, and new energy band engineering has formed.

  近年来这些成果被应用于半导体器件和电路的研制，形成一门新的能带工程。

• Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.

  半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。

• Many semiconductor devices discussed in the previous chapters can be operated in the microwave region.

  前面几章讨论的许多半导体器件都可以在微波波段运行。

• The asymptotic behavior of the drift diffusion model for semiconductor devices is studied.

  研究半导体器件的漂移-扩散模型方程解的渐近性。

• Power semiconductor devices develop continuously for high frequency, high efficiency and intellectualization. It demands that power electronic control system has much higher real-time capability.

  随着电力半导体器件不断地向高频、高效和智能化方向发展，电力电子控制系统的实时性要求越来越高。

• The effects of choosing lapping bevel Angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.

  讨论了在检测半导体器件和集成电路芯片时，不同研磨倾斜角度对扩展电阻量值的影响。