英语释义

1. a rolled or forged member (as of steel) that is imperfect because of insufficient material

2. an incompletely filled can or container

片语

Underfill Crack底部填充裂缝

Underfill adhesive底部填充胶

underfill theory充盈不足学说

underfill materials底部填充料

underfill system欠量装粉法

Underfill Voiding底部填充空洞

underfill method炸开孔穴填筑路堤法

Underfill Encapsulation覆晶底层充填封装分析

underfill detail装填不满

英汉例句

• in this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and 3d mold flow simulation.

  文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

• the die cracking with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.

  用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。

• as the density for mobile electronic product becomes higher and higher and underfill technology improved, more and more underfill material have been developed.

  随着移动电子产品的密度越来越高，底层填充技术逐步提高，越来越多的底层填充材料被研发。

• underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

  基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。

• the first underfill is filled between the first chip and the second chip in order to wrap the first bump.

  以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；

• a cure-dependent viscoelastic model was applied to describe the mechanical behavior of underfill .

  采用与固化过程相关的粘弹性力学模型描述倒装焊底充胶的力学行为。

• through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.

  通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。

• it provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling.

  它能形成一致和无缺陷的底部填充层，能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的沖击。

• it was found that the application of underfill encapsulation can improve reliability of flip chip significantly.

  证明了在使用下部填充料后，倒装芯片的热应力可靠性将大大提高。

• in this paper we report the analysis of underfill encapsulation between the solder ball, m…

  文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

• in order to minimize the cost of product and maximize its reliability, evaluate and develop proper underfill material and process becomes necessary.

  为了降低产品的价格并增加产品的可靠性，底层填充材料的性能评估已成为亟须进行的研究工作。

• in this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip …

  文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。

• this speech includes two sections : the first section will introduce jetting technology's application in pop, csp underfill process and uv precision coating .

  演讲分为两部分，第一部分讲述喷射科技在层叠芯片（pop）底部充胶工艺以及uv胶精密涂敷工艺中的应用。

• in addition, the impact of underfill properties on thermomechanical reliability of the fcob assembly was addressed.

  另外，还研究了下部填充料对倒装芯片封装热应力可靠性的影响。

• the key tech-nologies of flip chip technology are that redistribution technology, under bump metallurgy(ubm), bump technology, reflow technology and underfill technology.

  倒装技术是发展的关键技术，它包括再分布技术、凸点底层金属（ubm）技术、凸点制备技术、倒扣焊接技术和底部填充技术等。

• engineers can optimize via design using ansys tools, identifying and resolving the effects of coating and underfill materials.

  工程师可以使用ansys工具优化设计、识别和解决涂层和填充材料的影响。