plating solution中文,plating solution的意思,plating solution翻译及用法

2025-11-01 09:26 浏览次数 8

plating solution

英[ˈpleitiŋ səˈlu:ʃən]美[ˈpletɪŋ səˈluʃən]

电镀液

plating solution 例句

英汉例句

  • the high concentration plating solution was specially prepared and the technological process was also improved.

    配制了高浓度刷镀液,改进了摩擦材料和镀液供给系统,制定了严格的刷镀工艺。

  • using molecular sieve type plating solution additive is very favorable to raising coat thickness, coat adhesion and its stability.

    使用分子筛型镀液添加剂对提高镀层厚度、镀层结合力及其稳定性都非常有利。

  • it was proposed that the reducing agent of electroless plating solution could have some reducing reaction to the grain boundary of ptc ceramics and thus had influence on ptc effect.

    提出了化学镀镍溶液中的还原剂对ptc陶瓷的晶界产生还原从而影响ptc效应的观点。

  • experiences for maintenance of the barrel plating bath were summarized, and effects of the plating solution performance and some technique parameters on production cost were studied.

    本文总结了维护滚镀光亮镍镀液的经验,分析了镀液性能以及一些工艺参数对生产成本的影响。

  • the change of the current density of the upper and lower specification limits by plating solution is the nature of concentration, temperature and stirring, factors such as the decision.

    电流密度的变化的上限和下限是由电镀液的本性﹐浓度﹐温度和搅拌等因素决定的。

  • the effects of c2n2h8 on the properties of copper brush plating solution and copper deposits are investigated in the present paper.

    主要就乙二胺在电刷镀铜溶液中的作用及其对镀铜层性能的影响进行了试验研究。

  • comparison experiment results show that the failure is not caused by the permeation of plating solution but by the reaction happened in the electroless nickel plating.

    通过对比实验发现,这些样品的失效不是由于镀液的渗透引起的,而是与化学镀镍过程中的化学反应有关。

  • the age of an electroless nickel plating solution can have a significant effect upon the bath and upon the properties of its deposit.

    化学镀镍液的老化能对其镀层性能产生重大影响。

  • here, a method is suggested in which the plating solution in a deep tank is forced by a pump to circulate through the waveguide where a specific anode is installed.

    本文介绍的方法是用泵强制电镀液通过深槽并在波导内循环,同时使用特殊形状的阳极。

  • thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.

    因此,用钯导电体层形成溶液将工件转变成导体,所述溶液是中性的,不使用高堿性无电镀铜溶液。

  • it is shown that, the technology has good deep plating ability and homogeneous plating ability, a new mode of controlling zn and fe ion in plating solution put out by germany kunz company.

    应用表明,该工艺深镀能力和均镀能力较好。德国科兹公司提出镀液中锌、铁离子控制的新型模式。

  • satisfactory effect was achieved when using diagnosis chart and component index to diagnose whether component is sufficient or lack in plating solution for best result in production.

    运用诊断图表和指数法在生产中判断镀液成分的丰缺,获得了满意的效果。

  • the factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated.

    结果表明,优选出的的镀液稳定性相对较高、沉铜速度快、镀层外观较好。

  • the experimental results show that the nickel electroless plating solution was stable and the nickel coating obtained with…

    这说明玻璃表面用镍活化以取代用钯活化是一种可行的方法。

  • plating solution surface tension is too large, wetting agents insufficient.

    电镀溶液表面张力过大,湿润剂不足。

  • emphases are made on the selection of surfactant and the relationship between fluorinated carbon particle content in plating solution and that in coatings.

    包括优良表面活性剂的选择,镀液中氟化石墨微粒含量与镀层中微粒含量的关系以及操作条件的影响。

  • the traditional process, the chrome plating solution the chromium acid as the foundation and sulfuric acid as catalyst, the ratio of 100 to 1.

    传统的镀铬工艺,其电镀液以铬酸为基础,以硫酸作催化剂,两者的比例为100:1。

  • plating solution of quantitative supplies.

    电镀液的定量补给。

  • the absorption spectrum and copper deposition rate of a given chemical copper plating solution affected by different surfactants and polar organics were investigated.

    研究了固定的化学镀铜基础配方在表面活性剂与极性有机物作用下的吸收光谱和沉铜速率;

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