英语释义

1. a metal or metallic alloy used when melted to join metallic surfaces especially an alloy of lead and tin so used

2. something that unites

3. to unite or make whole by solder

4. to bring into or restore to firm union
a friendship soldered by common interests

5. to use solder

6. to become united or repaired by or as if by solder

7. a mixture of metals (such as lead and tin) that is melted and used to join metal parts together

8. to join (something made of metal) to something else with solder

9. a metal or a mixture of metals used when melted to join or repair surfaces of metal

10. to join together or repair with solder

片语

solderability y可焊性

Inside solderability内部可焊性

weldability[机] 焊接性；[机] 可焊性

solderability test[机] 焊接性试验

brazability solderability钎焊性

Improved solderability焊锡性大幅提高

organic solderability有机保焊剂

solderability tester可焊性测试仪

solderability deposit可焊性镀层

reflow solderability优异的耐焊接性

英汉例句

• the solderability depends on a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.

  钎料的钎焊性能很大程度上取决于钎料对基板的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。

• the non-bright tin deposit has good solderability after sealing.

  封闭后的雾面锡镀层仍有良好的可焊性。

• the effects of current density, bath temperature and coating thickness on the solderability and wetting balance of pd coating electroplated on phosphor-bronze were studied.

  研究了电流密度、镀液温度及镀层厚度对磷青铜上钯镀层的焊锡性与润湿平衡的影响。

• the environment of storage can affect the solderability of surface.

  存储环境对表面的可焊性有影响。

• high solderability due to specially plated electrodes.

  具高可焊性特殊电极端子。

• the quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

  引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。

• experiments were made on a range of current densities, in order to obtain a coating with fine appearance. the solderability of coating is evaluated.

  试验获得外观良好镀层的电流密度范围，并对镀层的可焊性作了评估。

• is solderability test being performed on all products & surface finishing? describe your test method.

  有无对所有的产品和表面镀层进行可焊测试？描述您的测试方法。

• the use of fluxes with different activities affects the solderability and wetting balance of pd coating.

  不同活性助焊剂的使用也会影响钯镀层的焊锡性能。

• that is why the solderability was measured before and after ageing also.

  这就是为什么可焊性要在老化之前和之后分别进行测量。

• deposit properties such as porosity, solderability and adhesion were tested.

  测定了锡镀层的孔隙率、可焊性和结合力。

• solderability of sn pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of mlci, etc.

  mlci端头电极锡-铅合金电镀工艺及维护、镀后的清洗、mlci的储存影响镀层的耐焊性和可焊性。

• the result proves that the process has advantages of high stabilization, excellent solderability and antitarnishing, which may replace high-pollution tin-lead electroplating technology.

  结果表明，该添加剂工艺稳定性好，且镀层可焊性优良、抗变色能力强，可取代高污染的锡铅电镀工艺。

• nickel and tin are plated to an aluminum surface possessing solderability and superb conductivity.

  镍和锡镀上铝制表面，具备可焊性和卓越的传导性。

• the results show that different imidazole has different solderability and that there is an optimal thickness giving the best solderability.

  结果表明，不同类型的咪唑化合物可焊性存在明显差异，可焊性有一最优的厚度。

• the solderability of as-plated pd coatings produced under different process conditions is good.

  镀态下，不同条件下制得的钯镀层具有良好的沾锡能力。

• copper wires tin except with solderability outside, still have a isolation insulating materials of sulfur in effect.

  铜导线上镀锡除提供可焊性外，还有隔离绝缘材料中硫的作用。

• this paper deals with results of solderability testing.

  本文论述焊料可焊性试验的结果。

• water-soluble oxidation-resistant agent is an organic solderability preservative.

  水溶性的防氧化剂是一种有机可焊性保护剂。

• is the solderability test frequency being performed at a minimum of once per lot?

  焊锡性测试最小测试频率是否为每批一次？

• and other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.

  同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。

• the solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates.

  钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能，而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。