片语

Micro solder ball bonding微钎料球键合

solder-ball connection焊球连接

Solder ball test锡球试验

SOLDER R BALL锡球

solder tin ball焊锡球

solder ball shear strength焊球剪切强度

sbc solder-ball connection焊球连接

lead solder ball中心定位引线焊球

inducing solder ball焊料球

英汉例句

• Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.

  介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。

• The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.

  最大累积等效蠕变应变位于内层焊点，且在芯片边缘。

• Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.

  最后探测锡球配置方式和缓沖层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。

• The study included three aspects, which are the resistance force appearing in the solder paste printing, the solder ball test and solder paste wetting test.

  焊膏印刷性能试验研究以下三个方面：焊膏印刷时所受到的阻力，焊膏焊料球试验和润湿试验。

• Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.

  激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。