leadless中文,leadless的意思,leadless翻译及用法

2026-03-21 16:57 浏览次数 12

leadless

英['ledlɪs]美['ledlɪs]

adj. 无铅的;不含四乙铅的

leadless 英语释义

英语释义

  • not treated with lead;

    "unleaded gasoline"

leadless 片语

片语

nonleaded无铅的

Leadless petrol无铅汽油

leadless gasoline无铅汽油

leadless colour无铅色料

lead free无铅的

leadless component无引线元件

leadless color无铅色料

leadless fritted无铅熔块

leadless glaze无铅釉

leadless goblet相关标签

leadless 例句

英汉例句

  • The performance of leadless and cadmiumless fluxing agent for overglaze colors was investigated through orthogonal experiments.

    运用正交实验方法对无铅无镉釉上彩熔剂性能进行研究。

  • The results will enable the leadless gasoline to be produced in series and then bring a remarkable profit for the refinery.

    本研究结果可使华北石油管理局第一炼油厂汽油产品实现无铅化、系列化 ,显着提高经济效益。

  • The effect of alkaline metal oxides and fluorides on the performances of green leadless fluxing agents for overglaze colors were studied by means of orthogonal experiments.

    应用正交试验法,研究了堿金属氧化物及氟化物对环保型无铅釉上彩熔剂性能的影响。

  • It is similar to Dr Echt’s leadless pacemaker, but it uses electromagnetic induction, rather than ultrasound, to stimulate a small implanted receiver, which in turn stimulates the heart.

    他的方法与DrEcht有些类似,但他没有用超声波而是利用电磁感应效应来刺激植入的小型接受器,接受器再刺激心脏。

  • The invention relates the rare earth modified leadless X ray barrier plastic.

    本发明涉及一种稀土改性全无铅x射线屏蔽塑料。

  • In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.

    文章通过试验证明:纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。

  • It has passed the International General-Purpose 「SGS」 Testing Approval. It is especially fit for the leadless welding.

    并已通过国际通用的「SGS」检测认可,特别适用于无铅焊接。

  • The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;

    本发明公开了一种无铅无卤素锡焊膏,包括以下重量份组分:合金粉 80-98,助焊剂2-20;

  • The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.

    本发明缩小了半导体器件的封装尺寸,降低了产品成本。

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