片语

Function of Solder joint焊点的功能

Solder joint strength关于焊点的强度

Cold solder joint冷焊点；虚焊

e solder joint多余焊点

porous solder joint多孔焊点

Starved Solder Joint少锡焊点

solder joint connection焊点连接

The Solder Joint这种焊料连接

solder joint shapes theory焊点形态理论

英汉例句

• the welding quality of the solder joint on the conducting wire connected with the soldering cover and the pcb.

  导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。

• the higher height and the smaller diameter of solder joint are formed by the smaller heating factors of reflow soldering profile.

  回流曲线的加热因子越小，焊接得到的焊点的高度越高，直径越小。

• are aoi/ axi complementary methods, which include solder joint inspection, used for all reflowed parts?

  axi的检验方法包括焊接点的检验，是否用于回流焊元件检测?。

• solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.

  焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。

• the solder will be dull looking and if the gold content in the solder exceeds about5% the solder joint will be brittle.

  焊点外观将变得暗淡，此外，如果焊料中的金成分超过约5%时，焊点将会变脆。

• the orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (pbga) component.

  基于正交试验设计法对塑封球栅阵列（pbga）器件焊点工艺参数与可靠性关系进行了研究。

• smt solder joint reliability issues caused by drop impact are received more and more attention in recent years.

  随着微电子封装密度的提高，板级封装在跌落沖击载荷下的可靠性成为人们关注的焦点。

• through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.

  通过非线性有限元分析，计算出焊点疲劳寿命对下部填充料基本热力学性质的依赖关系。

• the effect of gas hole location on smt solder joint fatigue life has been analyzed by finite element method .

  分析发现，与无缺陷焊点相比，气孔使焊点中应力应变分布发生了改变，使焊点疲劳寿命缩短；

• the software which was adopt to come true based on image processing used for solder joint image processing and quality judgement.

  软件用于焊点图像的处理及质量判定，采用基于图像处理技术实现。

• research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.

  笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；

• the experiment results show that there is linear relationship between the solder joint creep damage and its resistance changes.

  研究表明，焊点的蠕变损伤与其电阻变化存在着线性关系。

• semiconductor analysis with ansys tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation.

  利用ansys工具，可以分析半导体的非线性特性，其中包括封装变形、焊接点蠕变以及过孔设计中的断裂、疲劳和层间开裂。

• the reliability of the solder joint decides the quality and development of electronic production. in fact, heat action is the main reason for the failure of electronic package.

  焊点的可靠性问题是电子封装技术领域亟待解决的重要课题，是决定电子产品质量与发展的基本问题。

• this paper analyzed the linear displacement and angular displacement error between electrode axis and solder joint normal caused by deformation of the bracket from the theoretical aspect;

  从理论上分析了托架变形所引起的电极轴线和焊点法线之间的线位移和角位移误差对焊点质量的影响；

• finally the life of csp solder joint based on pb-free material 95.

  基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。

• the process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.

  该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。

• according to the characteristics that smt solder joint quality is related to its 3-d geometrical shape directly, theory of solder joint shape was put forward.

  结合仿真技术模拟焊点形态，可以找出造成焊点缺陷时各参数之间的关系并提出相应的解决方案，从而优化工艺设计及制造工艺控制参数。

• this work does the process of lead-free reflow soldering under n2 protection, and the solder joint quality has been analyzed statistically.

  通过新制定的氮气保护无铅再流焊工艺，对焊点外观质量进行了统计分析。

• smt solder joint reliability issues caused by drop impact are received more and more attention in recent years. research results of theories and experiments in this field are summarized.

  针对在跌落碰撞条件下便携式电子产品中smt连接焊点的可靠性问题，对该领域相关的理论和实验研究成果进行了综述。

• the prediction of fatigue life, especially high-cycling fatigue life, of a solder joint is one of the most difficult problems in electronic industry.

  最后，提出了简便预测这类结构的高周疲劳寿命方法，且预测结果与试验结果吻合较好。

• moreover, an experimental method of touch pin measurement to analysis solder joint shapes was put forward, the results show the calculating results and the experimental results were identical well.

  提出了一种用触针测量法研究焊点三维形态的实验方法，并对计算结果和实验结果进行了比较，结果表明，计算结果与实验结果吻合良好。

• interface void damage is the failure characteristic of solder joint under temperature cycling.

  温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度。