片语

lead-free solder tin paste无铅焊锡膏

Big solder paste大焊宝

Solder Paste Technology焊膏工艺

solder tin paste焊锡膏

Solder Paste Rheology锡膏流变学

Solder paste printing锡膏印刷

solder cream焊膏

solder r paste printer焊膏印刷机

solder r paste焊膏

英汉例句

• are lcd「s and ucla」s defined for the average and range of solder paste measurements?

  对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?。

• the result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.

  研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。

• is the storage fridge temperature of solder paste controlled?

  是否对存放焊膏的电冰箱温度进行控制？

• the paper discusses the smt process of solder paste printing for electronic product with high throughput and high-quality.

  讨论了电子产品s mt制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。

• recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.

  回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。

• is a company specializing in the development of automatic solder paste printing, production, sales and service of high-tech enterprises.

  东莞富海精密机械有限公司是一家专门从事全自动锡膏印刷机的开发，生产，销售和服务的高新技术企业。

• the present invention relates to a solder paste composition used for precoating an electrode surface with solder.

  本发明提供一种钎焊膏组合物，该组合物可应用于电极表面预涂钎 料。

• for solder paste with more small particles introduced, shear-thickening appears before the onset of shear thinning.

  当小尺寸焊料添加达到一定量时，在剪切变稀开始前出现剪切增稠现象。

• take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.

  以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。

• how to elevate the print precision of solder paste printer is a problem worth exploring.

  文中就影响无铅锡膏印刷机视觉系统定位精度的几个关键因素进行研究。

• as soon as finishing screen printing the rest of solder paste should be back into a special vast and the attentions according to the 2nd notes.

  全部印刷完毕后，剩余的焊膏应尽快回收到一个专门的回收瓶内，并如同注意事项2与空气隔绝保存。

• this article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.

  该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。

• so study lead-free solder paste in the electronic application package is important.

  因此研究无铅锡膏在电子封装中的应用具有重要意义。

• in this research, a ai-method based on neural networks and genetic algorithms is used to determine the best process parameter in solder paste printing process.

  本文采用基于神经网络与遗传算法的一种混合结构即神经网络—遗传算法，解决锡膏印刷制程中的参数优化的问题。

• from the beginning of the 1990s, cleaning free solder paste help in the field of electronics industry of electronic components and printed circuit board welding is widely used in production.

  从90年代初开始，免清洗助焊膏在电子工业领域里的电子元器件与印制板的焊接生产中广泛应用。

• the uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology(smt) product line.

  建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。

• this test is with some resistors and no solder paste - the reason the resistors are not staying in place.

  这项测试是与一些电阻和没有锡膏-电阻不到位停留的原因。

• the causes for defects from the point of wetting force for the flux activity of solder paste were studied, the solder paste according to the wetting force was selected.

  对焊膏的助焊剂活性从润湿力的角度研究导致缺陷的成因，并根据润湿力选择备选焊膏。

• in 2009 dek provided solder paste and flux printing equipment deemed vital to intel's success.

  得可在2009年为英特尔提供的锡膏和助焊剂印刷设备，被认为是英特尔赖以成功的重要因素之一。

• attention questions and measures during bga assembly were analyzed to increase bga assembly quality by bga package, pcb design, solder paste print, place bga, and reflow soldering process.

  从bga的封装形式、pcb的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了bga组装过程中应注意的问题及其预防措施。

• the products use the soldering set with automatically feeding solder paste and automatically breaking the solder paste to effectively prevent the solder explosion.

  该系列产品采用自动送锡&自动破锡焊具，有效防止了了锡爆。

• the results show that i and o solder paste reflow curve in the use of two processes, all of the welding results can be accepted;

  实验结果表明，锡膏i和o在使用两种回流焊曲线工艺时，所有的焊接结果都可以接受；

• the factors affecting soldering ability of rosin-based flux for lead-free solder paste , and the factors affecting erosion resistance are discussed.

  实验结果表明，松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。