solder mask中文,solder mask的意思,solder mask翻译及用法

2026-04-14 08:39 浏览次数 21

solder mask

英[ˈsɔdə mɑ:sk]美[ˈsɑdɚ mæsk]

焊接掩模;焊接淹模

solder mask 片语

片语

Top Solder Mask焊层

liquid photoimageable solder mask液态照片成像焊料掩膜

copper covered by only solder-mask铜焊锡只涵盖的

Printing Solder-mask丝印阻焊

Solder mask slump焊锡掩膜下陷

Solder Mask Options液态光敏阻焊剂硬度

Photoimageable Solder Mask能顺利剥除感光绿漆

solder mask 例句

英汉例句

  • Now we can use temporary solder mask to solve all the problems.

    现在,我们可以用临时阻焊膜来解决这一问题。

  • The text on the two solder mask layer is same, we will cancel the text that on this solder mask layer, please refer to Q9.

    此层上的字符与另一层绿油上的字元相同,请确认是否可以取消此层上的该字符。请看Q9处。

  • The solder mask is configured on the dielectric layer and covers the circuit layer.

    焊罩层配置在介电层上且覆盖线路层。

  • Please see below picture, those letters overlap at circuit layer and solder mask. We suggest deleting the letters in solder mask layer.

    如图,那些字在线路和阻焊层都有,我们建议删除阻焊上的字。

  • The execution of the liquid photoimageable solder mask of the printed circuit board was briefly introduced. The process and its quality control were also illuminated.

    本文对印制板液态感光成形阻焊剂的制作进行了简单介绍,对该制程的工艺过程和品质控制进行了较为详细的论述。

  • In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.

    另外,在阻焊膜涂覆前,用等离子体对印制电路板面处理一下,还可获得一定的粗糙度和高活性的表面,从而提高阻焊膜层的附着力。

  • The manufacture of liquid photosensitive solder mask for PCB by screen printing is briefly introduced. The process and its quality control are also discussed in detail.

    对印制板采用丝网印刷液态感光成形阻焊剂的制作进行了简单介绍,并对该制作工艺和品质控制进行了较为详细的论述。

  • A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.

    一种改善变形的半导体封装基板,主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。

  • The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.

    该防焊层形成于该可挠性介电层上,以局部覆盖该些引脚,并依不同应用可覆盖或显露该补强金属图案。

  • Is the viscosity of the solder mask after preparation checked to ensure the quality?

    在检验前是否测试防焊的粘性以确保品质?

相关热词