The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.
讨论了弯曲跨距、焊盘尺寸等参数、以及焊点所经历的回流、老化等热过程对PC B焊点弯曲可靠性的影响。
When the first signal defect is produced, make the signal-exerting solder pad mutually short-circuit.
在产生第一信号缺陷时,使所述信号施加焊盘相互电短接。
The static protecting line connects between the first virtual solder pad and the second virtual solder pad having a charge inducting pad which is exposed at surface of the flexible loader.
静电防护线连接于第一虚设焊盘与第二虚设焊盘之间并通过 印刷电路板连接至接地端或电源端,且静电防护线上具有电荷导入垫,其暴露于软性承载器表面。
The wider track provides better impedance matching at solder pad interfaces and provides better immunity to PCB manufacturing process variations.
更宽的线在焊盘接口提供更好的阻抗匹配、为PC B柔性加工过程提供更好的豁免权。