片语

bulk silicon dissolved wafer process体硅溶解薄片法

silicon-wafer cells太阳电池

semiconductor silicon wafer半导体硅片

silicon epitaxial wafer硅外延片

silicon wafer engineering硅片工程

Silicon and Wafer Price Index硅和晶圆价格指标

silicon backing wafer翻译

silicon chips硅片；硅芯片；硅晶片

monocrystalline silicon polished wafer硅单晶抛光片

silicon polished waferSi抛光片

英汉例句

• the effect of surface roughness of planar surface on silicon wafer to device construction has been paid more attention than before with the rapid development of ulsi.

  随着大规模集成电路的快速发展，硅片表面微粗糙度对于器件制造的影响也越来越受到人们的重视。

• the surface grinding temperature of the silicon wafer ground by diamond wheels is studied.

  研究金刚石砂轮磨削单晶硅片时的表面磨削温度。

• the important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon wafer thickness.

  硅片的表面起伏幅度、起伏的空间波长、表面张力、材料弹性和硅片厚度都是影响接触表面缝隙封闭的重要因素。

• making the beams interfere perfectly so that the silicon wafer traps them both is tricky business, a recipe that requires precisely controlling the two beams' traits.

  如何实现两束光的完美干涉，使硅晶片将其囚禁，是一个技巧性的工作，需要精确控制两束光的状态。

• when polish silicon wafer directly bond, there are avery thin transition field and a tiny lattice-error, but no more stress in drawn into.

  当抛光硅片直接键合时，界面出现极薄的过渡区，并存在微小的晶向差，但不引起多余应力。

• the new device is a silicon wafer about the shape and size of a playing card.

  这个新设备是一张纸牌大小的硅晶片。

• the high quality silicon wafer is the basic of chip manufacturing and ic development.

  高质量的硅晶片是芯片制造和ic发展的基础；

• started with silicon wafer our tffec processes consist of wet isotropic chemical etching for cone formation, oxidation and etching for tip sharpening and self-aligned gate process.

  我们用硅材料为基体，用各向同性的湿法化学腐蚀工艺制出尖端，用氧化增尖和自对準栅极工艺制成tffec—薄膜场发射阴极。

• the suntech researchers developed a way to chemically treat the silicon wafer in narrow bands. these treated areas attract silver, which forms metal lines just 20 micrometers wide.

  尚德的研究人员研发了一种化学方法，在窄带中处理硅片，该区域能吸收银，形成宽约20微米的金属线。

• the corporation, built in 1966, is one of the biggest silicon wafer manufactures in china now.

  公司始建于1966年，是中国目前最大的硅半导体材料生产基地之一。

• a model was proposed on the elastic deformation of silicon wafer contact in bonding.

  提出了键合过程中硅片接触的一种弹性形变模型。

• a quantitative mechanism of particle removal from silicon wafer surfaces by wet chemical cleaning process was proposed.

  对化学法清洗硅片过程中消除颗粒的机理作了定量的探讨。

• the microscope comprises a silicon wafer filter membrane which is highly- planar and does not fluoresce.

  该显微镜包含高度平坦和不发荧光的硅晶片过滤膜。

• the invention discloses a silicon wafer with perforating holes and a manufacturing method thereof.

  本发明公开了一种具有穿导孔的硅晶片及其制造方法。

• another is a ceramic dielectric waveguide covered by a silicon wafer with high resistivity.

  另一种是用高阻硅薄片覆盖在陶瓷介质波导上组成的。

• the final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer .

  按照顺序从每一块掩膜版上将图形一层一层地转移到硅片的表面，就制得了成品集成电路。

• a chip , on the other hand, is a silicon wafer that a core resides on.

  而芯片（chip）是将核心封装起来的一块硅片。

• in order to reduce the thermal conductivity and heating capacity and increase the detectivity of array, the suspended structure was formed on silicon wafer by chemical etching of koh.

  为了降低热导和热容，提高探测器的探测灵敏度，用koh作化学腐蚀完全去除了线性阵列下方的硅衬底，形成悬空结构。

• in experiment, a series of silicon nitride thin films are prepared on cleaned silicon wafer by varying deposition parameters.

  本实验通过系统地改变沉积参数，在经过清洗好的单晶硅片上沉积了一系列的氮化硅薄膜。