barrier layer中文,barrier layer的意思,barrier layer翻译及用法

2025-09-06 14:29 浏览次数 7

barrier layer

英[ˈbæriə ˈleiə]美[ˈbæriɚ ˈleɚ]

[电子] 阻挡层;势垒层

barrier layer 英语释义

英语释义

    1. the surface of contact between a semiconductor (such as cuprous oxide) and a metal (such as copper) that acts as an alternating current rectifier or photovoltaic cell when included in a circuit

barrier layer 片语

片语

barrier-layer cel光生伏打电池

barrier r layer rectifier阻挡层整流器

double barrier enhancement layer双重势垒增强层

barrier-layer film障壁层薄膜

Barrier-layer photocell硒光电池

barrier r layer阻挡层

cell barrier-layer障壁层元件

barrier-layer penetration阻挡层穿透

barrier layer 例句

英汉例句

  • good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.

    利用化学镀镍作阻挡层,化学镀金作可焊层,可得到良好的焊接效果。

  • therefore, the barrier layer can prevent grinding fluid from infiltrating to the substrate during the polishing process, and further improve the effect and the quality of polishing and grinding.

    因而,所述阻绝层可防止研磨液在抛光过程中渗透到底材,以提高抛光研磨效果和质量。

  • the vt transients reflect the change of the barrier layer thickness.

    对应的电压与时间关系曲线则反映了阻挡层厚度的变化。

  • the alloy coating obtained is used as the barrier layer of wrought rolled copper foil in pcb manufacturing.

    该锌-镍合金作为印制板用压延铜箔的阻挡层。

  • the formation of the interfacial barrier layer is depended on the alloying element and its content in alloy films.

    界面阻挡层的形成与二元铜合金体系中掺杂元素的种类和含量有着密切的关系。

  • the barrier layer (22) is then deposited in contact with the last interconnect (16) layer and bounded by the polyimide layer (22).

    随后沉积阻挡层(22)使其接触最后的互连层(16)并由聚酰亚胺层(22)定界。

  • the sea surface wind stress and net heat flux in the pn section affect the seasonal variation of the barrier layer depth by changing the mixed layer depth every season.

    海面风场和凈热通量场通过改变混合层的深度影响pn断面处黑潮水和陆架水之间的混合,而海面降水对于pn断面上的水团分布特征没有显着影响。

  • the at least one barrier layer comprises a first polymer composition comprising a polymer matrix and a low molecular weight additive.

    至少一个阻隔层含有第一聚合物组合物,该组合物含有聚合物基质和低分子量添加剂。

  • nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit.

    以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。

  • typical chemical mechanical polishing (cmp) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.

    半导体器件上铜层化学机械抛光(cmp)的第一道工序一般需要使用一块硬抛光垫,在磨去阻挡层的工序中要用到软垫。

  • the barrier layer is positioned on the substrate.

    所述阻绝层位于所述底材上。

  • the superiority of hdpe used in barrier layer of landfill was expatiated through the comparison of several manmade composite materials.

    通过对几种人工合成材料的比较,阐述了高密度聚乙烯(hdpe)土工膜在生活垃圾填埋场防渗层中应用的优越性。

  • in ac electrical field, the stable homogeneous glow discharge will appear by using dielectric barrier layer and high-frequency power source.

    在交流电场中,利用介质阻挡层和高频激励源,可获得稳定均匀的大气压下辉光放电。

  • the invention relates to a polishing pad with a barrier layer and a manufacturing method thereof, and the polishing pad comprises a substrate, the barrier layer and a grinding layer.

    本发明涉及一种具有阻绝层的抛光垫和其制造方法,所述抛光垫包括底材、阻绝层和研磨层。

  • it is found that the stepcoverage is improved with the increase of temperature by using barrier layer and silicides in the aluminum metallization process of a sub\|micron ic device.

    在亚微米ic器件的铝金属化工艺中,采用了阻挡层和硅化物后,发现随着铝淀积温度的升高,铝的阶梯覆盖率有所提高。

  • a preparation method of anodic aluminum oxide film with thick barrier layer is provided, which belongs to the field of material technology.

    一种属于材料技术领域的具有厚阻挡层的阳极氧化铝薄膜的制备方法。

  • the fall is interpreted as caused by barrier_layer formation and the rise by pore initiation when the field across the barrier layer has fallen low enough to allow the entry of protons into the film.

    当落在阻挡层上的电压降足够低 ,使得质子可以进入阻挡层 ,这时孔的雏形形成 ;

  • to obtain this arrangement, the ternary alloy barrier layer is replaced by a barrier layer composed of alternations of binary alloy barrier layers (54, 55).

    为了获得这种配置,使用由二元合金阻挡层(54,55)交替构成的阻挡层来代替三元合金阻挡层。

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